Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: ( a ) Top view of the P0 and P1 designed layers and ( b ) the added P2 and Metal layers for the proposed micromirror in MEMSPro, using PolyMUMPs fabrication process.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: ( a ) Top view of the micromirror showing the L-shaped arm and three fixed bottom electrodes generated using COMSOL simulation software and ( b ) schematic view of the arm and the three bottom electrodes. COMSOL simulation results shows the distribution of generated electrostatic force and the upward movement of the. The device physical properties are provided in .

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques: Generated, Software

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: COMSOL simulation results illustrating deflection versus width of an individual arm without micromirror (solid line, triangle) and an L-shaped arm (dashed line, circle) connected to the micromirror.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: COMSOL simulation results illustrating deflection versus separation distance between fixed bottom electrodes for a micromirror with an L-shaped arm. The length and width of the L-shaped arm are 400 µm and 8 µm, respectively.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: Physical properties of the micromirror with the air cavity of 2.75 µm.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: ( a ) Oblique view of the 400 µm by 400 µm micromirrors and ( b ) proposed micromirror simulated using COMSOL Multiphysics. ( c ) The schematic view of the L-shaped arm with three fixed bottom electrodes showing the upward movement of the arm and ( d ) cross-sectional view of the micromirror designed in MEMSPro using the PolyMUMPs fabrication technique.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: Employed mask layers and their purposes in the PolyMUMPs fabrication technique.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: Cross-sectional view of the resulting micromirror.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: Schematic view of COMSOL simulation result showing the tilting of the micromirror surface where one end of the micromirror surface moves upward and the other end deflects downward with an unequal amplitude of deflection.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Micromachines

Article Title: A Method to Enhance Stroke Level of a MEMS Micromirror with Repulsive Electrostatic Force

doi: 10.3390/mi11040401

Figure Lengend Snippet: COMSOL simulation results presenting the effect of the input voltage on the upward (blue, circle) and downward (orange, square) deflections of the designed micromirror with a gap 2.75 µm.

Article Snippet: The designed micromirror is proposed to utilize the PolyMUMPs fabrication technique from MEMSCAP Inc.

Techniques:

Journal: Sensors (Basel, Switzerland)

Article Title: Overview of Electrochemical DNA Biosensors: New Approaches to Detect the Expression of Life

doi: 10.3390/s90403122

Figure Lengend Snippet: Types of oligonucleotide and cDNA microarrays.

Article Snippet: Febit , Non contact , In situ synthesis , Oligonucleotide , Micromirror , NA , NA/30 – 60 mer , 24 – 72.

Techniques: In Situ, In Vitro

Journal: Microsystems & Nanoengineering

Article Title: A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams

doi: 10.1038/s41378-023-00570-8

Figure Lengend Snippet: a Test setup (before and after the impact). b The micromirror is fixed on the ball for lateral impact from Newton’s ball. c The lateral impact test results of two types of micromirrors. d The micromirror is fixed on the ball for vertical impact from Newton’s ball. e The impact test results of two types of micromirrors

Article Snippet: Fig. 7 Comparison of the failure positions of two types of micromirrors and simulation analysis results. a Whole device of the damaged SiO 2 -type micromirror. b – e Close views of the failed positions of SiO 2 -type micromirrors. f Whole device of the damaged PSPI-type micromirror. g – j Close views of the failed positions of PSPI-type micromirrors. k Simulation results of the stress distribution of the SiO 2 -type micromirror. l Simulation results of the stress distribution of the PSPI-type micromirror 3D models of both types of micromirrors have been built in the COMSOL software to determine the stress distribution difference between these two types.

Techniques:

Journal: Microsystems & Nanoengineering

Article Title: A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams

doi: 10.1038/s41378-023-00570-8

Figure Lengend Snippet: a Photograph of the micromirror after encapsulation in the TO package. b Close view of the micromirror with bonded wires. c The drop test results of both types of micromirrors encapsulated with TO packages. d The micromirror is fixed on the OCT probe. e Photograph of the OCT probe after encapsulation with a transparent hard plastic shell. f The drop test results of two types of OCT probes encapsulated with a transparent hard plastic shell

Article Snippet: Fig. 7 Comparison of the failure positions of two types of micromirrors and simulation analysis results. a Whole device of the damaged SiO 2 -type micromirror. b – e Close views of the failed positions of SiO 2 -type micromirrors. f Whole device of the damaged PSPI-type micromirror. g – j Close views of the failed positions of PSPI-type micromirrors. k Simulation results of the stress distribution of the SiO 2 -type micromirror. l Simulation results of the stress distribution of the PSPI-type micromirror 3D models of both types of micromirrors have been built in the COMSOL software to determine the stress distribution difference between these two types.

Techniques: Encapsulation

Journal: Microsystems & Nanoengineering

Article Title: A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams

doi: 10.1038/s41378-023-00570-8

Figure Lengend Snippet: a The overall appearance of the vibration system and a close view of the vibrating plate. b The micromirror is fixed on the top plate for vertical vibration of the mirror plate. c The vertical vibration test results of two types of micromirrors. d The micromirror is fixed on the sidewall for vibration of the mirror plate. e The parallel vibration test results of two types of micromirrors

Article Snippet: Fig. 7 Comparison of the failure positions of two types of micromirrors and simulation analysis results. a Whole device of the damaged SiO 2 -type micromirror. b – e Close views of the failed positions of SiO 2 -type micromirrors. f Whole device of the damaged PSPI-type micromirror. g – j Close views of the failed positions of PSPI-type micromirrors. k Simulation results of the stress distribution of the SiO 2 -type micromirror. l Simulation results of the stress distribution of the PSPI-type micromirror 3D models of both types of micromirrors have been built in the COMSOL software to determine the stress distribution difference between these two types.

Techniques:

Journal: Microsystems & Nanoengineering

Article Title: A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams

doi: 10.1038/s41378-023-00570-8

Figure Lengend Snippet: a Whole device of the damaged SiO 2 -type micromirror. b – e Close views of the failed positions of SiO 2 -type micromirrors. f Whole device of the damaged PSPI-type micromirror. g – j Close views of the failed positions of PSPI-type micromirrors. k Simulation results of the stress distribution of the SiO 2 -type micromirror. l Simulation results of the stress distribution of the PSPI-type micromirror

Article Snippet: Fig. 7 Comparison of the failure positions of two types of micromirrors and simulation analysis results. a Whole device of the damaged SiO 2 -type micromirror. b – e Close views of the failed positions of SiO 2 -type micromirrors. f Whole device of the damaged PSPI-type micromirror. g – j Close views of the failed positions of PSPI-type micromirrors. k Simulation results of the stress distribution of the SiO 2 -type micromirror. l Simulation results of the stress distribution of the PSPI-type micromirror 3D models of both types of micromirrors have been built in the COMSOL software to determine the stress distribution difference between these two types.

Techniques: